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SMAJ SERIES
Surface Mount Transient Voltage Suppressor
Voltage Range 5.0 to 170 Volts 400 Watts Peak Power
Features
For surface mounted application Low profile package Built-in strain relief Glass passivated junction Excellent clamping capability Fast response time: Typically less than 1.0ps from 0 volt to BV min. Typical IR less than 1A above 10V High temperature soldering guaranteed: 260OC / 10 seconds at terminals Plastic material used carries Underwriters Laboratory Flammability Classification 94V-0 400 watts peak pulse power capability with a 10 x 1000 us waveform by 0.01% duty cycle (300W above 78V).
SMA/DO-214AC
.062(1.58) .050(1.27) .111(2.83) .090(2.29)
.187(4.75) .160(4.06)
.103(2.61) .078(1.99)
Mechanical Data
Case: Molded plastic Terminals: Solder plated Polarity: Indicated by cathode band Standard packaging: 12mm tape (EIA STD RS-481) Weight: 0.064 gram
.056(1.41) .035(0.90) .210(5.33) .195(4.95)
.012(.31) .006(.15) .008(.20) .004(.10)
Dimensions in inches and (millimeters)
Maximum Ratings and Electrical Characteristics
Rating at 25ambient temperature unless otherwise specified. Type Number
Peak Power Dissipation at TA=25 C, Tp=1ms(Note 1)
O
Steady State Power Dissipation Peak Forward Surge Current, 8.3 ms Single Half Sine-wave Superimposed on Rated Load (JEDEC method) (Note 2, 3) Maximum Instantaneous Forward Voltage at 25.0A for Unidirectional Only Operating and Storage Temperature Range
Symbol PPK Pd IFSM VF
Value Minimum 400 1 40.0 3.5
Units Watts Watts Amps Volts
O TJ, TSTG -55 to + 150 C O Notes: 1. Non-repetitive Current Pulse Per Fig. 3 and Derated above TA=25 C Per Fig. 2. 2. Mounted on 0.2 x 0.2" (5 x 5mm) Copper Pads to Each Terminal. 3. 8.3ms Single Half Sine-wave or Equivalent Square Wave, Duty Cycle=4 Pulses Per Minute Maximum. Devices for Bipolar Applications 1. For Bidrectional Use C or CA Suffix forTypes SMAJ5.0 through Types SMAJ170. 2. Electrical Characteristics Apply in Both Directions.
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RATINGS AND CHARACTERISTIC CURVES (SMAJ SERIES)
FIG.1- PEAK PULSE POWER RATING CURVE
PEAK PULSE POWER (Pppm) or CURRENT (lpp) DERATING IN PERCENTAGE, %
100 100
FIG.2- PULSE DERATING CURVE
Pppm, PEAK PULSE POWER, KW
NON-REPETITIVE PULSE WAVEFORM SHOWN in FIG. 3 TA=250C
75
10
50
1.0
25
0.2" sq 5.0mm2 COPPER PAD AREAS 0.1 10 s 0.1 s 1.0 s
100 s
1.0ms
10ms
0 0 25 50 75 100 125
O
150
175
200
td. PULSE WIDTH, sec.
TA, AMBIENT TEMPERATURE. C
FIG.3- PULSE WAVEFORM
150 50
FIG.5- MAXIMUM NON-REPETITIVE PEAK FORWARD SURGE CURRENT
PEAK FORWARD SURGE CURRENT. (A)
lppm, PEAK PULSE CURRENT %
PULSE WIDTH (td) is DEFINED tr=10 sec. AS THE POINT WHERE THE PEAK CURRENT DECAYS to 50% of lppm
100
40
8.3ms Single Half Sine Wave JEDEC Method TJ=TJ max.
PEAK VALUE lppm HALF VALUE- lpp 2 10/1000 sec. WAVEFORM AS DEFINED BY R.E.A.
30
20
50
10
0 0
td
1.0 2.0 t, TIME, ms 3.0 4.0
0 1 10 NUMBER OF CYCLES AT 60Hz 100
FIG.4- TYPICAL JUNCTION CAPACITANCE
10,000
Tj=25 0C f=1.0MHz Vsig=50mVp-p
Cj, JUNCTION CAPACITANCE, pF
1,000
MEASURED AT ZERO BIAS
100
MEASURED AT STAND-OFF VOLTAGE,VWM
10 1
10 V(BR), BREAKDOWN VOLTAGE. (V)
100
200
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ELECTRICAL CHARACTERISTICS (TA=25OC unless otherwise noted)
Device Device Marking Code AD AE AF AG AH AK AL AM AN AP AQ AR AS AT AU AV AW AX AY AZ BD BE BF BG BH BK BL BM BN BP BQ BR BS BT BU BV BW BX BY BZ CD CE CF CG CH CK CL CM CN CP CQ CR CS CT Working Peak Reverse Voltage
Breakdown Voltage
VWM(Volts)
SMAJ5.0 SMAJ5.0A SMAJ6.0 SMAJ6.0A SMAJ6.5 SMAJ6.5A SMAJ7.0 SMAJ7.0A SMAJ7.5 SMAJ7.5A SMAJ8.0 SMAJ8.0A SMAJ8.5 SMAJ8.5A SMAJ9.0 SMAJ9.0A SMAJ10 SMAJ10A SMAJ11 SMAJ11A SMAJ12 SMAJ12A SMAJ13 SMAJ13A SMAJ14 SMAJ14A SMAJ15 SMAJ15A SMAJ16 SMAJ16A SMAJ17 SMAJ17A SMAJ18 SMAJ18A SMAJ20 SMAJ20A SMAJ22 SMAJ22A SMAJ24 SMAJ24A SMAJ26 SMAJ26A SMAJ28 SMAJ28A SMAJ30 SMAJ30A SMAJ33 SMAJ33A SMAJ36 SMAJ36A SMAJ40 SMAJ40A SMAJ43 SMAJ43A 5.0 5.0 6.0 6.0 6.5 6.5 7.0 7.0 7.5 7.5 8.0 8.0 8.5 8.5 9.0 9.0 10 10 11 11 12 12 13 13 14 14 15 15 16 16 17 17 18 18 20 20 22 22 24 24 26 26 28 28 30 30 33 33 36 36 40 40 43 43
V(BR) (Volts) at IT Min. Max. 6.40 7.30 6.40 7.00 6.67 8.15 6.67 7.37 7.22 8.82 7.22 7.98 7.78 9.51 7.78 8.60 8.33 10.3 8.33 9.21 8.89 10.9 8.89 9.83 9.44 11.5 9.44 10.4 10.0 12.2 10.0 11.1 11.1 13.6 11.1 12.3 12.2 14.9 12.2 13.5 13.3 16.3 13.3 14.7 14.4 17.6 14.4 15.9 15.6 19.1 15.6 17.2 16.7 20.4 16.7 18.5 17.8 21.8 17.8 19.7 18.9 23.1 18.9 20.9 20.0 24.4 20.0 22.1 22.2 27.1 22.2 24.5 24.4 29.8 24.4 26.9 26.7 32.6 26.7 29.5 28.9 35.3 28.9 31.9 31.1 38.0 31.1 34.4 33.3 40.7 33.3 36.8 36.7 44.9 36.7 40.6 40.0 48.9 40.0 44.2 44.4 54.3 44.4 49.1 47.8 58.4 47.8 52.8
Test Current IT (mA) 10 10 10 10 10 10 10 10 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0
Maximum Clamping Voltage at IPPM VC(Volts) (Note 5) 9.6 9.2 11.4 10.3 12.3 11.2 13.3 12.0 14.3 12.9 15.0 13.6 15.9 14.4 16.9 15.4 18.8 17.0 20.1 18.2 22.0 19.9 23.8 21.5 25.8 23.2 26.9 24.4 28.8 26.0 30.5 27.6 32.2 29.2 35.8 32.4 39.4 35.5 43.0 38.9 46.6 42.1 50.0 45.4 53.5 48.4 59.0 53.3 64.3 58.1 71.4 64.5 76.7 69.4
Maximum Peak Pulse Surge Current IPPM (Note 5)(Amps) 41.7 43.5 35.1 38.8 32.5 35.7 30.1 33.3 28.0 31.0 26.7 29.4 25.2 27.8 23.7 26.0 21.3 23.5 19.9 22.0 18.2 20.1 16.8 18.6 15.5 17.2 14.9 16.4 13.9 15.4 13.1 14.5 12.4 13.7 11.2 12.3 10.2 11.3 9.3 10.3 8.6 9.5 8.0 8.8 7.5 8.3 6.8 7.5 6.2 6.9 5.6 6.2 5.2 5.8
Maximum Reverse Leakage at VWM ID (uA) 800 800 800 800 500 500 200 200 100 100 50.0 50.0 10.0 10.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0
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ELECTRICAL CHARACTERISTICS (TA=25OC unless otherwise noted)
Device Device Marking Code Working Peak Reverse Voltage
Breakdown Voltage
VWM(Volts)
SMAJ45 CU 45 SMAJ45A CV 45 SMAJ48 CW 48 SMAJ48A CX 48 SMAJ51 CY 51 SMAJ51A CZ 51 SMAJ54 RD 54 SMAJ54A RE 54 SMAJ58 RF 58 SMAJ58A RG 58 SMAJ60 RH 60 SMAJ60A RK 60 SMAJ64 RL 64 SMAJ64A RM 64 SMAJ70 RN 70 SMAJ70A RP 70 SMAJ75 RQ 75 SMAJ75A RR 75 SMAJ78 RS 78 SMAJ78A RT 78 SMAJ85 RU 85 SMAJ85A RV 85 SMAJ90 RW 90 SMAJ90A RX 90 SMAJ100 RY 100 SMAJ100A RZ 100 SMAJ110 SD 110 SMAJ110A SE 110 SMAJ120 SF 120 SMAJ120A SG 120 SMAJ130 SH 130 SMAJ130A SK 130 SMAJ150 SL 150 SMAJ150A SM 150 SMAJ160 SN 160 SMAJ160A SP 160 SMAJ170 SQ 170 SMAJ170A SR 170 Notes: O 1. Non-repetitive current pulse, per Fig. 3 and derated above TA=25 C per Fig. 2 2 2. Mounted on 5.0mm copper pads to each terminal O 3. Lead temperature at TL=75 C 4. Measured on 8.3ms single half sine-wave duty cycle=4 pulses per minutes maximum 5. Peak pulse power waveform is 10/1000 us 6. For BI-Directional devices having VR of 10 volts and under, the IR limit is double.
V(BR) (Volts) at IT Min. Max. 50.0 61.1 50.0 55.3 53.3 65.1 53.3 58.9 56.7 69.3 56.7 62.7 60.0 73.3 60.0 66.3 64.4 78.7 64.4 71.2 66.7 81.5 66.7 73.7 71.1 86.9 71.1 78.6 77.8 95.1 77.8 86.0 83.3 102 83.3 92.1 86.7 106 86.7 95.8 94.4 115 94.4 104 100 122 100 111 111 136 111 123 122 149 122 135 133 163 133 147 144 176 144 159 167 204 167 185 178 218 178 197 189 231 189 209
Test Current IT (mA) 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0
Maximum Clamping Voltage at IPPM VC(Volts) (Note 5) 80.3 72.7 85.5 77.4 91.1 82.4 96.3 87.1 103 93.6 107 96.8 114 103 125 113 134 121 139 126 151 137 160 146 179 162 196 177 214 193 231 209 266 243 287 259 304 275
Maximum Peak Pulse Surge Current IPPM (Note 5)(Amps) 5.0 5.5 4.7 5.2 4.4 4.9 4.2 4.6 3.9 4.3 3.7 4.1 3.5 3.9 3.2 3.5 3.0 3.3 2.9 3.2 2.0 2.2 1.9 2.1 1.7 1.9 1.6 1.7 1.4 1.6 1.3 1.5 1.1 1.3 1.0 1.2 1.0 1.1
Maximum Reverse Leakage at VWM ID (uA) 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0
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This device is designed specifically for
APPLICATION NOTES:
Recommended Pad Layout
The pad dimensions should be 0.010" longer than the contact size in the lead axis. This allows a solder fillet to form, see figure below. Contact factory for soldering methods.
transiient voltage suppression from threats generated by ESD for board levelload switching components. The wide leads assure a large surface contact for good heat disipation, and a low resistance path for surge current flow to ground. This series is designed to optimize board space and for use with surface mount technology automated assembly equipment. They can be easily mounted on printed circuit boards and ceramic substrates to protect sensitive components from transient voltage damage.
Dimensions in inches and (millimeters)
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